| Segment | Value | % of Price | Type |
|---|---|---|---|
| Net Cash | $6 | 2% | auditable |
| Advanced Logic (N3/N2) | $200 | 61% | anchored |
| Mature & Specialty Nodes | $50 | 15% | anchored |
| Advanced Packaging (CoWoS/SoIC) | $60 | 18% | anchored |
| Geopolitical Premium/Discount | $10 | 3% | anchored |
Anchored: $320/sh (97%) · Speculative: $0/sh (0%)
Advanced logic is TSMC's crown jewel — the leading-edge manufacturing nodes (3nm, 2nm, and upcoming A16/1.6nm) where TSMC holds over 90% market share with no credible challenger. In Q4 2024, advanced technologies (7nm and below) accounted for 74% of wafer revenue, with 3nm alone reaching 26% (up...
TSMC's advanced packaging business — centered on Chip-on-Wafer-on-Substrate (CoWoS) and System-on-Integrated-Chips (SoIC) — has become the critical bottleneck in the global AI chip supply chain. CoWoS is the only proven technology for packaging high-bandwidth memory (HBM) alongside logic dies in...
TSMC's mature and specialty node business encompasses 7nm and older process technologies, serving automotive, IoT, industrial, analog, and RF applications. In FY2024, these nodes accounted for 31% of total wafer revenue (~$28B), down from 42% in 2023 as advanced nodes grew faster. While the revenue...
TSMC's geopolitical situation is unique in global markets: the company manufactures 92% of the world's most advanced semiconductors on an island 100 miles from China. A disruption of Taiwan's semiconductor output could cost the global economy an estimated $2.5 trillion annually. This creates a...